0.11 Ultra-low Leakage

 Overview

CSMC 0.11 ULL process uses aluminum interconnects, 1P8M architecture, offering 1.5V core device and 3.3V I/O device with ultra-low-leakage features, typical Ioff (pA/um)<0.5.

 Key Features 
- Single poly, eight-metal-layer process
- Al backend with low-K FSG material
- Device Ioff (typical) <0.5 pA/um

 Applications
- MCU
- IOT

 0.11 ULL flash 

 Overview

CSMC 0.11 ULL flash process technology is embedded flash based on 0.11 ULL, core device is compatible with ULL process, offering ultra-low power analog IP.

 Key Features
- Double poly, eight-metal-layer process
- Al backend with low-K FSG material
- Competitive flash macro cell size

 Application 
- MCU
- IOT