Company Profile Enterprise Culture Social Responsibilities Contact Us
Power Device Power Module Power IC Intelligent Sensor Intelligent Control Application and Solutions Customer Service
Wafer Foundry Assembly & Testing Wafer Test Final Test Mask Manufacturing Customer Services
Company Management Stock Information Investor Services
Company News
Talent Development Talent Care Industry-university-research Cooperation

Manufacturing

TSSOP

 TSSOP Series

Packaging NamePin QuantityPackaging Size
(Length*Width)/mm		Packaging
Thickness(mm)		Pin Distance/mmRemarks
TSSOP/8LD83.0x4.40.9250.65　
TSSOP/14LD145.0x4.40.9250.65　
TSSOP-EP/14LD145.0x4.40.9250.65EDP 3.56X3.05
TSSOP(M)16165.0x4.40.9250.65　
TSSOP/16LD165.0x4.40.9250.65　
TSSOP-EP/16LD165.0x4.40.9250.65EDP 3.66X2.745
TSSOP(M)20206.5x4.40.9250.65　
TSSOP20206.5x4.40.9250.65　
TSSOP20-F206.5x4.40.9250.65EDP 4.2x3.0
TSSOP(M)24247.8x4.40.90.65　
TSSOP(M)28289.7x4.40.90.65　
TSSOP/28LD289.7x4.40.9250.5　
TSSOP/28LD-13/18289.7x4.40.9250.5lack PIN6
TSSOP-EP/28LD289.7x4.40.9250.5EDP 5.9X3.0
TSSOP-EP/28LD-R289.7x4.40.9250.5reversal TF
TSSOP(M)38389.7x4.40.90.5　
TSSOP484812.5 x6.10.9240.5